SI, PI, EMC, EMI & Thermal Analysis

PCB Analysis

Growing number of Hardware companies are experiencing a sharp upturn in system-level Signal Integrity, Thermal and Reliability issues that result in project delays and increased cost.Ram Systems quick turn design analysis services addresses needs of these customers by providing expert resources at very affordable prices.The analysis is carried out in two phase, the pre and post layout analysis.

Ram Systems SI engineers are having strong knowledge in SI theory and expertise in simulation tools to analyze various SI/PI issues like reflection,Return loss, due to impedance mismatch, crosstalk, signal attenuation and PDN noise which affects the interconnect performance.

Pre-Layout SI Analysis

Prior to Layout Process creation, there are set of pre layout analysis need to be done , such as Planning Topology Creation, Controlled Impedance stack up, study on Dielectric material properties, termination schemes, routing length optimization, Stubs optimization, placement optimization, Trace properties (Trace width,spacing and Skew matching), Via properties and layout guidelines for layout designer in pre-layout analysis.

Post-Layout SI Analysis

Post layout analysis includes Review Layout to ensure good Layout practice, simulations of Finished board for SI/PI issues like cross-talk, Reflection, Attenuation, PDN and EMI issues. 

SI Analysis

  • Reflection, Ringing waveform analysis
  • Single ended and Differential pairs Cross-talk Analysis
  • Signal Degradation due to Skin-effect, insertion loss, Dielectric Loss
  • Eye Diagram Analysis
  • I/O Buffer Information Specification(IBIS) based system SI
  • Clock synchronous Analysis
  • DDR2,DDR3,DDR4 Timing Analysis
  • Propagation delay and timing analysis
  • S-parameter Analysis
  • Return loss, Insertion loss, NearEnd Cross-talk (NEXT) and Far End Cross-talk(FEXT) Analysis
  • Frequency Domain Analysis

PI Analysis

  • DC Noise Analysis
  • IR/DC Drop Analysis
  • Internal Plane Noise Analysis
  • PDN AC/DC Impedance Analysis
  • Transient noise estimation analysis
  • De-coupling Analysis

EMI & EMC Analysis

  • Board-wise and Net-wise radiated EMI Analysis
  • EMC Analysis done as per FCC, CISPR and VCCI Requirements

Thermal Analysis

  • Applying thermal parameters along with surrounding environment and boundary conditions
  • Simulation performed for all ambient temperature conditions
  • Results include Component temperature profile, Board temperature profile and Board gradient results to understand the overall thermal behaviour of the board
  • Modelling heat sinks and thermal plates to ensure proper heat dissipation
  • Environmental Conditions
  • Pre-Simulation Analysis
  • Modes of Heat transfer and the effect on System Level
  • Component Junction & Case Temperature Computations